There is a global trend for the use of silicon carbide (SIC) as an attractive alternative to silicon as a semiconductor base material specifically for applications that require high power. The popularity of SIC tablets is derived from the excellent thermal conductivity, inherent stability, mechanical durability and the broad gap of the zone, allowing electronic components to operate with higher capabilities and to provide improved performance.
SIC GEAs have many different applications, including converters, converters, batteries and power supplies, and are used in multiple industries such as automaker, renewable energy, telecommunications, defense and information and communication technology (ICT). Essential electronics and high -power radio devices.
The use of SIC tablets has numerous processing challenges for manufacturers throughout the supply chain, from monocryl to the IC package (integrated circuit). Traditionally, production processes have been better tailored to applications that include silicon (SI). However, the treatment of silicon carbide (SIC) for tile production involves working with a much more difficult material using techniques that have not yet been fully optimized for this purpose.
Throughout the construction process, Sic Geafers, generally 6 to 8 inches in size, are often treated. Extreme cruelty and courtesy significantly increase the risk of hitting, breaking or breaking. To combat this risk, sic gafers are given limbs (usually R- or F-Type) according to semi-models. These acne profiles are usually created using diamond wheels, which can cause issues such as the wear of the diamond wheel, uneven grinding and inappropriate angle formation. In addition, this process is also time consuming and leads to high construction costs.
The latest innovation of GF Machining Solutions, Laser S 500 U, Revolutionises Sic Wafer Manufacturing. This advanced laser removal machine combines high dynamics with precise thermotherapy, providing unparalleled end quality profile, precision and consistency. The machine offers several significant advantages that convert the construction process. Non -contact technology eliminates the deterioration of tools, ensures the reliability of the process and maintains consistent quality on long production routes without the risk of breaking.
In terms of efficiency, the S 500 U laser significantly reduces processing times from hours to minutes. It also substantially reduces costs per section by eliminating the need for expensive grinding tools. In addition, the combination of the motor and GF’s own CAM software, Lasersuite360, allows for any acne profile, not not only a notches or disk -size.
These benefits are achieved through an innovative process that includes a completely comprehensive solution from CAD/CAM to execution of machinery, performed at extremely high speeds due to high dynamic movements, innovative processing strategies and stable accuracy.
The solution enhances the processing of tiles with advanced features, such as integrated camera technology, which accurately identifies critical areas and reads the identification numbers. This allows for the re -size of the 8 -inch exits in new 6 -inch tiles, which were completed with their special recognition numbers, all processed with the same solution.
